At the 2025 IEEE International Electron Devices Meeting (IEDM), research centre Imec is presenting breakthrough performance of p-type FETs with monolayer WSe 2 channels, and improved fab-compatible ...
The continuous miniaturisation of electronic devices has led to the innovations of more powerful, compact devices. These electronic devices, such as smart phones and laptops, are the key enablers of ...
The race for faster, more efficient chips has reached a new milestone. Scientists at Shanghai’s Fudan University have unveiled the world’s first full-featured 2D flash chip, an engineering feat that ...
A 2D flash chip enabled by system integration. CHINA DAILY A research team from Shanghai-based Fudan University has developed the world's first full-featured, 2D flash chip enabled by system ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
In the push to make gadgets faster and more efficient, silicon might finally have met its match. Researchers at Fudan University in Shanghai have developed a working prototype that merges atomically ...
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