Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

There is plenty that's visually attractive in The Package Design Book 3, which showcases the 2013 and 2014 winners of global packaging design competition Pentawards, selected by a large ...

But an integrated 3D chip/package/board co-design environment provides the ability to holistically optimize the package, board, and IC design to a greater degree than was possible in the past by ...

The white cooler, which keeps a bottle of champagne chilled for up to two hours, is among the many examples cataloged in Material Innovation: Packaging Design from Thames & Hudson ($30 ...

CloudLab's printQ 3D Packaging Design adds the ability to create and order packaging for eCommerce print solutions. All sorts of graphical content and customizable sizes and shapes of cartons and ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at ...

Signal and power integrity are top priorities for any chip design. But supplying signals and power smoothly to all chiplets in 2.5D and 3D packages under dynamic loading conditions can be daunting ...

ROME, Jan. 14, 2025 -- MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, today unveiled GENIO EVO, the first integrated chiplet/package EDA tool to ...