Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...
Customers can now access more capabilities and capacity for expanded production methods, simplifying custom mechanical sourcing. SAN FRANCISCO, Jan. 17, 2024 /PRNewswire/ -- Fictiv, a global ...
If all goes as forecast, this summer processor Owens-Illinois will begin commercial processing of compression molded PET preforms. The Toledo, OH company says it has taken shipment of a compression ...
When engineers at General Dynamics Armament and Technical Products (GDATP) recently designed the ammunition container for a new aircraft weapon system, they decided very early in the process to make ...
HARTWELL, Ga., Feb. 11, 2025 /PRNewswire/ -- Redline Plastics, a leader in rotational and compression molding, delivers complete, end-to-end manufacturing solutions across the Southeastern United ...
Chopped prepreg molding compound (CPMC), a relatively new material form resembling molding compounds made from chopped resin impregnated tow, provides design and processing engineers various benefits ...