Most of us use our cell phones, smart watches and other electronic devices without giving much thought to the components and how they fit and work together. But it’s a complex problem that ...

The University of Arkansas announced Tuesday (Feb. 17) that it has received $3.5 million from the National Institute of ...

Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component ...

A technical paper titled “Substrate Embedded Power Electronics Packaging for Silicon Carbide MOSFETs” was published by researchers at University of Cambridge, University of Warwick, Chongqing ...

In today’s fast-paced world, high-value electronics—such as smartphones, laptops, gaming consoles, and medical devices—are an essential part of daily life and business operations. These items are not ...

In an era of collapsing economies, waning affluence, and too much garbage amid scarcity, a characteristic that is part of the engineering character – resourcefulness – is due to come back in vogue, as ...

Power devices continue to evolve rapidly as SiC and GaN technologies become more efficient, integrated, and cost-effective. Meanwhile, steady improvements in MOSFET structures and processes enable ...

Electronics design and testing were once two distinct functions where an electronic design was breadboarded and populated ...

Gain Real-World Experience: Two blocks of cooperative education provide you with hands-on, full-time paid work experience in the packaging science industry ...

Analyst Insight: When packaging engineers are brought in late in the process, a small issue can turn into major operational problems. A recent planter redesign showed how a quarter-inch mismatch ...

At APEC 2025, Nexperia announced several important additions to its portfolio of enhancement-mode GaN and SiC devices. Among them is a new series of 1,200-V SIC MOSFETs available in thermally enhanced ...