SK Hynix Inc., the world’s top DRAM memory chipmaker, aims to redefine the competitive landscape in artificial intelligence ...

Taiwan Semiconductor (TSM) is nearing the rollout of an advanced chip packaging mechanism to power Nvidia (NVDA) and Alphabet (GOOGL) Google’s superior artificial intelligence (AI) chips.

Samsung Electronics’ foundry unit has stabilized test yields for the logic die powering next-generation high-bandwidth memory (HBM4) chips. The milestone marks an important step as the company works ...

“These techniques largely leverage physical security tags baked into the chip functionality or packaging,” he said ... are randomly and uniformly distributed on the chip sample substrate, but their ...

TAIPEI -- Taiwan Semiconductor Manufacturing Co. is close to finalizing the specifications for a radically new approach to chip packaging to meet demand for more powerful AI chips, with plans to ...

This system is capable of packaging chips with a high accuracy of ±0.8μm using thermal compression bonding “TCB” on 515mm × 510mm and 600mm × 600mm panels complying with the SEMI Standards.

Industry sources said the world’s largest contract chipmaker plans to focus its advanced packaging efforts on its system-on-integrated chips, or SoIC. In addition to AMD, Nvidia’s recently announced ...

Qualification testing is slated for June, with the first samples to be handed ... a capacity to produce 6.3 million chips per day. Kaynes has secured a multi-year agreement with Alpha Omega ...

Bijoy Das. izmo Microsystems partners with IIT Madras to advance SiP solutions for programmable photonic chip packaging. The CoE-CPPICS has been established on 1st January 2021 in the Department ...

Investing.com-- Taiwan Semiconductor Manufacturing Co, or TSMC, is close to finalizing specifications for an advanced approach to chip packaging in order to meet demand for more power artificial ...

The company is currently building a production line for the advanced packaging at a plant in Taoyuan, Taiwan, with small batches of production expected to start around 2027. Chip packaging ...

This system is capable of packaging chips with a high accuracy of ±0.8μm using thermal compression bonding "TCB" on 515mm × 510mm and 600mm × 600mm panels complying with the SEMI Standards. It can ...