At the 2025 IEEE International Electron Devices Meeting (IEDM), research centre Imec is presenting breakthrough performance of p-type FETs with monolayer WSe 2 channels, and improved fab-compatible ...

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...

Traditional CMOS chips are fabricated by applying and then etching repeated layers of different materials, applied to a wafer ...

A sub-class of Si spin qubits uses metal-oxide-semiconductor (MOS) quantum dots to confine the electrons, a structure that ...

The $12K machine promises AI performance can scale to 32 chip servers and beyond but an immature software stack makes harnessing that compute challenging ...

Lam Research's pivotal role in AI chip production, its growth outlook, and key investment risks. Learn why LRCX stock is a Hold.

Form propels content in Robert Therrien's retrospective at the Broad. 'This Is a Story,' filled with enlarged plates and tables, cheeky chapels and flowing beards, has a charismatic presence.

Tesla did not build Dojo as a vanity project or a generic data center. It set out to create a purpose-built AI supercomputer that could ingest the company’s vast driving dataset and accelerate the ...

Getting good at LeetCode Java can feel like a puzzle sometimes, right? You see all these problems, and you’re not sure where ...

To cope with the memory bottlenecks encountered in AI training, high performance computing (HPC), and other demanding ...

MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.