The 3D framework is not just an enabler for engineering success—it's a roadmap for long-term business success.

Abstract: This paper describes the modeling and design of package-embedded magnetic-core inductors for a system-in-package-based high-efficiency integrated voltage regulator. An application example is ...

Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...