The 3D framework is not just an enabler for engineering success—it's a roadmap for long-term business success.

Abstract: This paper describes the modeling and design of package-embedded magnetic-core inductors for a system-in-package-based high-efficiency integrated voltage regulator. An application example is ...

Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...

Capcom Fighting Collection 2 had me before the first punch was thrown. As someone who spent far too much time in the arcades ...

Abstract: A brand new 3D ... art packaging solutions. In this paper, we demonstrated for the first time an integration of SoIC chip into InFO_PoP without increasing its form-factor. The SoIC was made ...

Prefab housing is poised to push forward as residents in fire-ravaged neighborhoods seek to rebuild — fast. Is L.A. ready for ...

The Sustainable Packaging Design Special Award is designed to recognise companies that have developed innovative packaging solutions that incorporates sustainability considerations. Elements would ...

Another way to see EMIB-T is the combination of EMIB 2.5D and Foveros 3D packaging technologies ... EMIB-T and package substrate, signal and power integrity analysis, and package assembly design kit ...

College of Chemistry, Zhengzhou University, Zhengzhou 450001, P. R. China ...

Early Bird registrations are now open for the biennial Australasian Packaging Conference, which is coordinated by the Australasian Institute of Packaging (AIP), and is open to all packaging ...