"Amazon alone can only do so much. But together, we can make an amazing impact." Amazon and Microsoft unveil surprising ...

Kerry Stevenson, aka "General Fabb" has written over 8,000 stories on 3D printing at Fabbaloo since he launched the venture ...

With its compact, elegant design and excellent OLED display, HP's flagship EliteBook is a fantastic machine -- but it's worth ...

Capcom Fighting Collection 2 had me before the first punch was thrown. As someone who spent far too much time in the arcades during the '90s and early 2000s, and still owns Street Fighter Alpha 3 on ...

Prefab housing is poised to push forward as residents in fire-ravaged neighborhoods seek to rebuild — fast. Is L.A. ready for a robot-built bungalow?

But as companies that have made the leap to some type of multi-die package have discovered, there are so many possible options and optimizations available that it’s difficult to keep track of them all ...

ROME, Jan. 14, 2025 -- MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, today unveiled GENIO EVO, the first integrated chiplet/package EDA tool to ...

I think about this year-end list of design books all year long, collecting stacks, reading hundreds of pages, pouring over countless images. I keep a list of the books that stick with me and feel ...

For those still looking for Christmas gifts, we round up this year's top architecture and design books as part of our review of 2024. Simply named Kiosk, this book features photos of more than 150 ...

Dr. Steen Tjarks is the CEO at T&T Design, a global packaging and artwork agency that specializes in private label. Private-label products have seen significant growth globally, and I see ...

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance ...

But leaving it to the very end—after the chiplets are assembled in the 2.5D or 3D package—can disrupt the design process. By evaluating thermals inside the package every step of the way ...