Capturing The Evolving AI Landscape: WTAI's November 2025 Rebalance Through 5 Core Pillars

With memory and networking becoming new bottlenecks, the Index added exposure to firms like SK Hynix, Broadcom and Astera ...
Electrical and Computer Engineering - Carnegie Mellon University

3D Chip Breakthrough to Accelerate AI

CMU, Stanford, Penn, MIT, and SkyWater Technology achieved a milestone with the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed ...
TMCnet

Semos.ai Announces Enterprise Pilot Program for Its Manager Agents Platform

Semos.ai is an enterprise AI platform built to transform how managers lead. With a multi-agent architecture grounded in ...

The First Crack In Nvidia's CUDA

Nvidia Corporation unveils a major CUDA update to counter Triton, boosting GPU programming and solidifying its AI software ...
Live Science

Breakthrough 3D wiring architecture enables 10,000-qubit quantum processors

The novel 3D wiring architecture and chip fabrication method enable quantum processing units containing 10,000 qubits to fit ...