Technical Paper: Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, ...

June 17, 2025 Advanced 1600V IGBTs for cost-sensitive, energy-conscious appliance markets STGWA30IH160DF2 IGBT combines a breakdown-voltage rating of 1600V and high thermal performance with efficiency ...

Imec has set a new benchmark in RF transistor performance for mobile applications. They present a gallium nitride (GaN) MOSHEMT on silicon (Si) that achieves both record ... This week at the 2025 ...

MRSI Systems, LLC filed a patent infringement lawsuit against Suzhou LieQi Intelligent Equipment Co., Ltd. (SZLQ) with Shenzhen Intermediate People's Court for infringement ... MRSI Mycronic is proud ...

Technical Paper: Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification This white paper discusses the rising complexity of multi-die semiconductor packages, ...

SEMI reported findings from its latest 300mm Fab Outlook report. The report shows global front-end semiconductor suppliers are accelerating expansion efforts to support ... SEMI announced the ...

June 13, 2025 Imec presents 150 GSa/s Digital-to-Analog Converter (DAC) achieving 300 Gb/s data transmission This week at the 2025 Symposium on VLSI Technology and Circuits, imec announced a ...

SEMI announced that its International Board of Directors has elected Dr. Tien Wu, CEO of Advanced Semiconductor Engineering, Inc. (ASE), as its new chair, and ... The MEMS & Sensors Industry Group ...

June 13, 2025 Smoltek Surpasses 1 Microfarad per Square Millimeter Capacitance Milestone Smoltek Nanotech Holding AB announces a major technological milestone in CNF-MIM capacitor development, having ...

StratEdge Corporation will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 336 at the International Microwave Symposium ... StratEdge Corporation ...

Surfx Technologies announced its acquisition by Mycronic's Global Technologies division. This strategic acquisition strengthens Surfx's position in the fast-growing ... In situ hydrogen plasmas are ...

Nordson Electronics Solutions has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson's ... Nordson Electronics Solutions ...